High Tg epoxy systems for composite applications
US8742018B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2009 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Mar 22, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/686
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.