Circuit board structure and packaging structure comprising the circuit board structure
US8742567B2 · kind B2 · utility
0Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2012 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.