Mechanisms for resistivity measurement of bump structures
US8742776B2 · kind B2 · utility
2Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2011 |
| Grant date | Jun 3, 2014 |
| Priority date | — |
| Expiry date | Sep 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The embodiments described above provide mechanisms for bump resistivity measurement. By using designated bumps on one or more corners of dies, the resistivity of bumps may be measured without damaging devices and without a customized probing card. In addition, bump resistivity may be collected across the entire wafer. The collected resistivity data may be used to monitor the stability and/or health of processes used to form bumps and their underlying layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.