Inventor · Hsinchu, TW

Mill-Jer Wang

79Patents
7h-index
65Co-inventors
71Inventor score

Filing activity: Jun 3, 2008 → Nov 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10741537B2 Semiconductor structure and manufacturing method thereof Emerging Cross-Sectional Technologies 31 Active
US9086452B2 Three-dimensional integrated circuit and method for wireless information access thereof Electricity 25 Active
US7750651B2 Wafer level test probe card Emerging Cross-Sectional Technologies 11 Active
US9341671B2 Testing holders for chip unit and die package Physics 9 Active
US8421073B2 Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC) Electricity 8 Active
US8922230B2 3D IC testing apparatus Emerging Cross-Sectional Technologies 8 Active
US8957691B2 Probe cards for probing integrated circuits Physics 7 Active
US9453877B2 Testing holders for chip unit and die package Physics 6 Active
US9664707B2 Testing holders for chip unit and die package Physics 6 Active
US9568543B2 Structure and method for testing stacked CMOS structure Electricity 5 Active
US10652987B2 Three dimensional integrated circuit electrostatic discharge protection and prevention test interface Electricity 4 Active
US8836363B2 Probe card partition scheme Physics 4 Active
US9817029B2 Test probing structure Electricity 4 Active
US9417285B2 Integrated fan-out package-on-package testing Electricity 4 Active
US9658281B2 Alignment testing for tiered semiconductor structure Physics 4 Active
US9671457B2 3D IC testing apparatus Emerging Cross-Sectional Technologies 4 Active
US8956889B2 Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) Electricity 3 Active
US8866488B2 Power compensation in 3DIC testing Physics 3 Active
US9252593B2 Three dimensional integrated circuit electrostatic discharge protection and prevention test interface Electricity 3 Active
US8146245B2 Method for assembling a wafer level test probe card Emerging Cross-Sectional Technologies 3 Active
US9372227B2 Integrated circuit test system and method Physics 3 Active
US9754847B2 Circuit probing structures and methods for probing the same Electricity 3 Active
US10067181B2 Testing holders for chip unit and die package Physics 3 Active
US9900970B2 Three dimensional integrated circuit electrostatic discharge protection and prevention test interface Electricity 2 Active
US10073135B2 Alignment testing for tiered semiconductor structure Physics 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.