Light emitting die (LED) lamps, heat sinks and related methods
US8746915B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2011 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Dec 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.