Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces

US8747687B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Vijay Immanuel Raman · Mannheim, DE
• Ilshat Gubaydullin · Ludwigshafen, DE
• Yuzhuo Li
• Mario Brands · Ludwigshafen, DE
• Yongqing Lan · Potsdam, US

Key dates

• Filing date: Apr 19, 2010
• Grant date: Jun 10, 2014
• Expiry date: Jul 12, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs.