Interposer based imaging sensor for high-speed image acquisition and inspection systems
US8748828B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2012 |
| Grant date | Jun 10, 2014 |
| Priority date | — |
| Expiry date | Sep 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.