Patent · US Active

Multi-layer integrated circuit package

US8748960B2 · kind B2 · utility

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1References
26Claims
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Assignee

Inventor

Key dates

Filing dateDec 21, 2012
Grant dateJun 10, 2014
Priority date—
Expiry dateDec 21, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A multi-layer integrated circuit package includes a switched-mode power supply circuit including a plurality of transistors which form part of a main current loop of the switched-mode power supply circuit. The plurality of transistors are arranged in one or more layers of the integrated circuit package. The package further includes a conductive plate arranged in a different layer of the integrated circuit package than the plurality of transistors. The conductive plate is in close enough proximity to at least part of the main current loop so that a current can be electromagnetically induced in the conductive plate responsive to a change in current in the main current loop.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.