Integration of precision MIM capacitor and precision thin film resistor
US8754501B2 · kind B2 · utility
6Cited by
0References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 14, 2013 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/206
Abstract
An integrated circuit with a high precision MIM capacitor and a high precision resistor with via etch stop landing pads on the resistor heads that are formed with the capacitor bottom plate material. A process of forming an integrated circuit with a high precision MIM capacitor and a high precision resistor where via etch stop landing pads over the resistor heads are formed using the same layer that is used to form the capacitor bottom plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.