Wafer dicing blade and wafer dicing apparatus including the same
US8757134B2 · kind B2 · utility
2Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Apr 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T407/19
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A wafer dicing blade includes a cutting part including a protrusion, the protrusion having a uniform region with a substantially uniform width, and a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.