Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
US8758087B2 · kind B2 · utility
1Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Aug 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02013
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.