Polishing method and polishing device
US8758090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Sep 6, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/245
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing method includes: mounting a wafer on a fixed abrasive polishing pad located on a polishing platen; delivering a polishing slurry to the fixed abrasive polishing pad to polish the wafer; and adsorbing abrasive particles generated during the polishing process with an electrode. The electrode has a polarity opposite to a polarity of charges of the abrasive particles. A polishing device includes a polishing platen, a fixed abrasive polishing pad, a slurry pipeline and a polarity changer having an electrode. Therefore, the abrasive particles generated during the polishing process are removed, which prevents the wafer from being scratched, thereby increasing wafer yield and improving efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.