Semiconductor packages and methods of fabricating the same
US8759147B2 · kind B2 · utility
47Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Oct 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.