Inventor · Anyang-si, KR

Chungsun Lee

29Patents
5h-index
47Co-inventors
65Inventor score

Filing activity: Aug 12, 2009 → May 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8759147B2 Semiconductor packages and methods of fabricating the same Electricity 47 Active
US8928132B2 Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package Electricity 30 Active
US8105934B2 Bump structure for a semiconductor device and method of manufacture Electricity 14 Active
US10157766B2 Method of fabricating a semiconductor device Electricity 6 Active
US9023716B2 Methods for processing substrates Emerging Cross-Sectional Technologies 5 Active
US9006081B2 Methods of processing substrates Electricity 4 Active
US9059072B2 Semiconductor packages and methods of fabricating the same Electricity 3 Active
US9412636B2 Methods for processing substrates Emerging Cross-Sectional Technologies 2 Active
US11996358B2 Semiconductor packages having first and second redistribution patterns Electricity 1 Active
US11335719B2 Semiconductor package including an image sensor chip and a method of fabricating the same Electricity 0 Active
US9595446B2 Methods of processing substrates Electricity 0 Active
US11854893B2 Method of manufacturing semiconductor package Electricity 0 Active
US11637058B2 Interconnection structure and semiconductor package including the same Electricity 0 Active
US12014977B2 Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure Electricity 0 Active
US12368093B2 Semiconductor packages Electricity 0 Active
US12394641B2 Molding apparatus of semiconductor package Electricity 0 Active
US11824076B2 Semiconductor package including an image sensor chip and a method of fabricating the same Electricity 0 Active
US11705323B2 Wafer trimming device Electricity 0 Active
US12224256B2 Wafer structure and semiconductor device Electricity 0 Active
US11688679B2 Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure Electricity 0 Active
US8933561B2 Semiconductor device for semiconductor package having through silicon vias of different heights Electricity 0 Active
US11923309B2 Semiconductor package including fine redistribution patterns Electricity 0 Active
US12218102B2 Semiconductor package Electricity 0 Active
US12094847B2 Semiconductor package and method of manufacturing the same Electricity 0 Active
US12009288B2 Interconnection structure and semiconductor package including the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.