Surface coating method, semiconductor device, and circuit board package
US8759161B2 · kind B2 · utility
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1References
14Claims
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Assignee
Inventor
Key dates
| Filing date | Jan 11, 2012 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jan 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a surface coating method, which contains applying a surface coating material to a layered structure so as to cover at least a surface of an insulating film of the layered structure, to form a coating on the surface of the insulating film, wherein the surface coating material contains a water-soluble resin, an organic solvent, and water, and wherein the layered structure contains the insulating film exposed to an outer surface, and a patterned metal wiring exposed to an outer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.