B-stageable and skip-curable wafer back side coating adhesives
US8759422B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J163/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.