Hybrid intergrated component

US8759927B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Johannes Classen · Reutlingen, DE
• Jens Frey · Echterdingen, DE

Key dates

• Filing date: May 10, 2013
• Grant date: Jun 24, 2014
• Expiry date: May 10, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0792
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A hybrid integrated component including an MEMS element and an ASIC element is refined to improve the capacitive signal detection or activation. The MEMS element is implemented in a layered structure on a semiconductor substrate. The layered structure of the MEMS element includes at least one printed conductor level and at least one functional layer, in which the micromechanical structure of the MEMS element having at least one deflectable structural element is implemented. The ASIC element is mounted face down on the layered structure and functions as a cap for the micromechanical structure. The deflectable structural element of the MEMS element is equipped with at least one electrode of a capacitor system. At least one stationary counter electrode of the capacitor system is implemented in the printed conductor level of the MEMS element, and the ASIC element includes at least one further counter electrode of the capacitor system.