Stacked semiconductor packages
US8759959B2 · kind B2 · utility
6Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.