Inventor · Seongnam-si, KR

Choong Bin Yim

20Patents
7h-index
20Co-inventors
65Inventor score

Filing activity: Oct 26, 1998 → May 23, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US7288835B2 Integrated circuit package-in-package system Electricity 77 Expired
US7312519B2 Stacked integrated circuit package-in-package system Electricity 29 Expired
US7298037B2 Stacked integrated circuit package-in-package system with recessed spacer Electricity 21 Expired
US7482203B2 Stacked integrated circuit package-in-package system Electricity 15 Active
US7501697B2 Integrated circuit package system Electricity 10 Active
US8187921B2 Semiconductor package having ink-jet type dam and method of manufacturing the same Electricity 9 Active
US7999368B2 Semiconductor package having ink-jet type dam and method of manufacturing the same Electricity 9 Active
US8759959B2 Stacked semiconductor packages Electricity 6 Active
US7884460B2 Integrated circuit packaging system with carrier and method of manufacture thereof Electricity 4 Active
US6124152A Method for fabricating cob type semiconductor package Electricity 4 Expired
US9190401B2 Stacked semiconductor packages Electricity 3 Active
US7755180B2 Integrated circuit package-in-package system Electricity 3 Active
US7446396B2 Stacked integrated circuit leadframe package system Electricity 2 Active
US9245863B2 Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights Electricity 1 Active
US7985623B2 Integrated circuit package system with contoured encapsulation Electricity 1 Active
US7679169B2 Stacked integrated circuit leadframe package system Electricity 1 Active
US8367465B2 Integrated circuit package on package system Electricity 0 Active
US8530280B2 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof Electricity 0 Active
US8049322B2 Integrated circuit package-in-package system and method for making thereof Electricity 0 Active
US8952513B2 Stack type semiconductor package and method of fabricating the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.