Patent · US Active

Method of manufacturing a semiconductor component and structure

US8766401B2 · kind B2 · utility

0Cited by

9References

22Claims

0Family size

Assignee

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

Phillip Holland · Los Gatos, US
Rong Liu · San Jose, US
Umesh Sharma · San Jose, US
Der Min Liou · San Jose, US
David D. Marreiro · Phoenix, US
Sudhama C. Shastri · Phoenix, US

Key dates

Filing date	Oct 1, 2010
Grant date	Jul 1, 2014
Priority date	—
Expiry date	Sep 17, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.