Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip
US8766433B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 31, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic chip, comprising: a semiconductor substrate (6) having an active area (8) formed by at least one P doped region and at least one N doped region which form one or more P-N junctions through which most of the useful current flows when said electronic chip is in a conductive state, and at least one channel (44) through which a heat transport coolant can flow, the channel(s) passing through at least said P or N doped region of the active area. Each channel (44) is rectilinear and passes through the substrate (6) in a direction which is collinear with a direction F to the nearest ±45°, where the direction F is perpendicular to the plane of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.