Moisture barrier for a wire bond
US8766436B2 · kind B2 · utility
38Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.