Method for forming an adhesive layer and adhesive composition
US8772176B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2011 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Mar 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.