Aqueous cleaning composition for removing residues and method using same
US8772214B2 · kind B2 · utility
2Cited by
13References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | May 10, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition and method for removing residues such as, without limitation, post etched and/or post ashed photoresist, plasma etching, ashing, and mixtures thereof from a substrate is described herein. In one aspect, there is provided a method for removing residues from a substrate comprising: contacting the substrate with a composition comprising: water; a quaternary ammonium hydroxide compound; a fluoride containing compound; and optionally a corrosion inhibitor wherein the composition is free of an added organic solvent and wherein the composition has a pH greater than 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.