Semiconductor device including resistor and method of fabricating the same
US8772855B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | Sep 15, 2010 |
| Grant date | Jul 8, 2014 |
| Priority date | — |
| Expiry date | Dec 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/474
Abstract
Embodiments of a semiconductor device including a resistor and a method of fabricating the same are provided. The semiconductor device includes a mold pattern disposed on a semiconductor substrate to define a trench, a resistance pattern including a body region and first and second contact regions, wherein the body region covers the bottom and sidewalls of the trench, the first and second contact regions extend from the extending from the body region over upper surfaces of the mold pattern, respectively; and first and second lines contacting the first and second contact regions, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.