Patent · US Active

Methods and integrated circuit package for sensing fluid properties

US8776274B2 · kind B2 · utility

1Cited by
0References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 31, 2012
Grant dateJul 15, 2014
Priority date—
Expiry dateOct 31, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An integrated circuit package for sensing fluid properties includes: a substrate made of semiconductor material; a fluid property measurement circuit formed on the substrate; and a sensor circuit coupled to the fluid property measurement circuit within a same integrated circuit package. The sensor circuit is configured to generate a field that interacts with the fluid. The fluid property measurement circuit is configured to determine a change in a property of the sensor circuit as results from the field interacting with the fluid and is further configured to determine a property of the fluid based on the change in the property of the sensor circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.