Conical sponge brush for cleaning semiconductor wafers
US8778087B2 · kind B2 · utility
4Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2033 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA46B13/00
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.