Patent · US Active

Plasma processing apparatus

US8778151B2 · kind B2 · utility

3Cited by
8References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 14, 2010
Grant dateJul 15, 2014
Priority date
Expiry dateNov 6, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/3266
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A plasma apparatus includes: a chamber which can be evacuated into vacuum; first electrode disposed within the chamber; a magnet mechanism having a magnet provided apart from and above the first electrode; a second electrode provided facing the first electrode; and a magnetic shield member provided in at least one of gaps between the first electrode and the magnet mechanism and between the first electrode and the second electrode.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.