Patent · US Active

Method of inspecting and processing semiconductor wafers

US8778702B2 · kind B2 · utility

0Cited by

3References

41Claims

0Family size

Assignee

Nanda Technologies GmbH · DE

Inventors

Lars Markwort · Haimhausen, DE
Reza Kharrazian · Stephanskirchen, DE
Christoph Kappel · Aschheim, DE
Pierre-Yves Guittet · Veldhoven, NL

Key dates

Filing date	Aug 16, 2010
Grant date	Jul 15, 2014
Priority date	—
Expiry date	Nov 21, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/20
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A wafer inspection method comprises imaging a full surface of the wafer at an imaging resolution insufficient to resolve individual microstructures which are repetitively arranged on the wafer. A mask 109 is applied to the recorded image and unmasked portions 111 of the image are further processed by averaging. The unmasked portions 111 are selected such that they include memory portions of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.