Packages including active dies and dummy dies and methods for forming the same
US8779599B2 · kind B2 · utility
34Cited by
57References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2011 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Nov 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically insulated from the bottom chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.