Package-on-package electronic devices including sealing layers and related methods of forming the same
US8779606B2 · kind B2 · utility
42Cited by
1References
18Claims
0Family size
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Key dates
| Filing date | Jan 4, 2013 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Jan 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.