Inventor · Asan-si, KR

Choongbin Yim

19Patents
3h-index
32Co-inventors
56Inventor score

Filing activity: Jun 29, 2007 → Nov 14, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US8779606B2 Package-on-package electronic devices including sealing layers and related methods of forming the same Electricity 42 Active
US8338941B2 Semiconductor packages and methods of fabricating the same Electricity 7 Active
US7800211B2 Stackable package by using internal stacking modules Electricity 5 Active
US9245867B2 Package-on-package electronic devices including sealing layers and related methods of forming the same Electricity 3 Active
US9245772B2 Stackable package by using internal stacking modules Electricity 3 Active
US10770446B2 Semiconductor packages and methods of manufacturing the same Electricity 2 Active
US8569114B2 Method of forming a semiconductor device package Electricity 1 Active
US11367688B2 Semiconductor package with interposer Electricity 1 Active
US9035308B2 Semiconductor package and method of fabricating the same Electricity 1 Active
US12148729B2 Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the same Electricity 0 Active
US10177131B2 Semiconductor packages and methods of manufacturing the same Electricity 0 Active
US11854989B2 Semiconductor package substrate and semiconductor package including the same Electricity 0 Active
US11521934B2 Semiconductor package including interposer and method of manufacturing the semiconductor package Electricity 0 Active
US11581263B2 Semiconductor package, and package on package having the same Electricity 0 Active
US11798889B2 Methods of manufacturing semiconductor packages Electricity 0 Active
US12424601B2 Semiconductor package and manufacturing method thereof Electricity 0 Active
US12388029B2 Semiconductor package Electricity 0 Active
US12021036B2 Semiconductor package including interposer and method of manufacturing the semiconductor package Electricity 0 Active
US11710673B2 Interposer and semiconductor package including the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.