Dynamic care areas
US8781781B2 · kind B2 · utility
15Cited by
260References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2011 |
| Grant date | Jul 15, 2014 |
| Priority date | — |
| Expiry date | Mar 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Various embodiments for determining dynamic care areas are provided. In one embodiment, a first inspection process is performed on a wafer after a first fabrication step has been performed on the wafer and before a second fabrication process has been performed on the wafer. One embodiment includes determining care areas for a second inspection process based on inspection results generated by the first inspection process. The second inspection process will be performed on the wafer after the second fabrication step has been performed on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.