Patent · US Active

Electrolytic method for filling holes and cavities with metals

US8784634B2 · kind B2 · utility

3Cited by

10References

25Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Bert Reents · Berlin, DE
Bernd Roelfs · Berlin, DE
Tafadzwa Magaya · Englewood, US
Markus Youkhanis · Berlin, DE
Rene Wenzel · Berlin, DE
Soungsoo Kim · Berlin, DE

Key dates

Filing date	Mar 30, 2007
Grant date	Jul 22, 2014
Priority date	—
Expiry date	Mar 26, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1492
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.