Bernd Roelfs
6Patents
3h-index
19Co-inventors
50Inventor score
Filing activity: Aug 30, 2005 → May 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8679316B2 | Aqueous, acid bath and method for the electrolytic deposition of copper | Electricity | 22 | Active |
| US9506158B2 | Method for copper plating | Electricity | 9 | Active |
| US9551080B2 | Copper plating bath composition | Electricity | 8 | Active |
| US8784634B2 | Electrolytic method for filling holes and cavities with metals | Electricity | 3 | Active |
| US9445510B2 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Electricity | 1 | Active |
| US9526183B2 | Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.