Package with a fan-out structure and method of forming the same
US8785299B2 · kind B2 · utility
563Cited by
0References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 30, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Nov 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.