Temporary adhesive composition, and method of producing thin wafer
US8785585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Mar 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.