Packaging of electronic circuitry

US8786068B1 · kind B1 · utility

Assignee

• International Rectifier Corporation · US

Inventors

• Timothy Alan Phillips · Hope, US
• Danny Clavette · Greene, US
• EungSan Cho · Torrance, US
• Chuan Cheah · Torrance, US

Key dates

• Filing date: Nov 30, 2011
• Grant date: Jul 22, 2014
• Expiry date: Jun 1, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19106
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A circuit package includes: electronic circuitry, electrically conductive material forming multiple leads, and multiple connections between the electronic circuitry and the multiple leads. A portion of the electrically conductive material associated with the multiple leads (e.g., low impedance leads supporting high current throughput) is removed to accommodate placement of the electronic circuitry. Each of the multiple leads can support high current. The multiple connections between the multiple leads provide connectivity between circuit nodes on the electronic circuitry and pads disposed on a planar surface of the electronic circuit package.