Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
US8787028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2012 |
| Grant date | Jul 22, 2014 |
| Priority date | — |
| Expiry date | Feb 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.