Patent · US Active

Method for integrating an electronic component into a printed circuit board

US8789271B2 · kind B2 · utility

6Cited by

5References

13Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Günther Weichslberger · Graz, AT
Arno Kriechbaum · Leoben, AT
Mike Morianz · Graz, AT
Nikolai Haslebner · Zeltweg, AT
Johannes Stahr · Kindberg, AT
Fritz Haring · Bruck an der Mur, AT
Gerhard Freydl · Leoben, AT
Andrea Koertvelyessy · Wien, AT
Mark J. Beesley · Carmel Valley, US
Andreas Zluc · Leoben, AT
Wolfgang Schrittwieser · Kapfenberg, AT

Key dates

Filing date	May 29, 2009
Grant date	Jul 29, 2014
Priority date	—
Expiry date	Mar 22, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.