Device having multiple wire bonds for a bond area and methods thereof
US8791007B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2011 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Aug 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.