Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate
US8791544B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2010 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
[Problem to be Solved] A semiconductor element having fine pitch electrodes is mounted on a substrate at low cost without reducing the number of input-output terminals.[Solution] Electrodes 1 for electrical connection and first inductors 2, arranged between the electrodes 1 in a manner neighboring the electrodes 1, for electromagnetic coupling are arranged on one main surface of the semiconductor element 3. On a substrate 5, second inductors 4 for electromagnetically coupling with the first inductors 2 are arranged in positions corresponding to the first inductors 2. The semiconductor element 3 is mounted on the substrate 5 so that the first and second inductors 2 and 4 face each other. Only desired input/output signals among input/output signals of the semiconductor element 3 are inputted or outputted from the external electrodes 11 of the substrate 5 in a manner being transmitted contactlessly by electromagnetic coupling between the first and second inductors 2 and 4 without going through the electrodes 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.