Microelectromechanical device with integrated package
US8791557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Oct 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.