Integrated circuit packages having redistribution structures
US8791580B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Nov 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.