Electronic component to be embedded in substrate and component-embedded substrate
US8791783B2 · kind B2 · utility
5Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2011 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | May 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.