Patent · US Active

Method and system to predict lithography focus error using simulated or measured topography

US8792080B2 · kind B2 · utility

2Cited by

12References

11Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian C. Sapp · Guilderland, US
Choongyeun Cho · Beacon, US
Lawrence A. Clevenger · Saratoga Springs, US
Laertis Economikos · Hopewell Junction, US
Bernhard R. Liegl · Cold Spring, US
Kevin S. Petrarca · Newburgh, US
Roger A. Quon · Austin, US

Key dates

Filing date	Jan 27, 2011
Grant date	Jul 29, 2014
Priority date	—
Expiry date	Jul 6, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG06F30/398
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method and system to predict lithography focus error using chip topography data is disclosed. The chip topography data may be measured or simulated topography data. A plane is best fitted to the topography data, and residuals are computed. The residuals are then used to make a prediction regarding the focus error. The density ratio of metal to dielectric may also be used as a factor in determining the predicted focus error.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.