Apparatus and method for drying substrates
US8793898B2 · kind B2 · utility
9Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2008 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | May 4, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.