Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same
US8794502B2 · kind B2 · utility
0Cited by
13References
21Claims
0Family size
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Key dates
| Filing date | Feb 6, 2013 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Feb 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.