Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8795032B2 · kind B2 · utility
15Cited by
41References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2009 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Feb 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/8593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.