Electrodeposition under illumination without electrical contacts
US8795502B2 · kind B2 · utility
3Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.